Overview

Posted
3 months ago
Internship Type
Summer
Remote Status
On-site
Location
Boston, MA, USA
Education Level
Bachelor's Degree
Education Status
Not specified
Field of Study
Mechanical Engineering
Categories
Not specified
Skills
Mechanical Engineering Prototyping PCB Design
Tags
Not specified
WHOOP is hiring Hardware Engineering Interns to build the next generation of wearable performance technology. Projects span sensor design, mechanical engineering, and PCB development for WHOOP straps and accessories. 12-week paid onsite program at our Boston HQ with mentorship from senior hardware engineers and a capstone demo to the VP of Hardware.